Hirose’s KM32A wire-to-board connector meets the GMW3191 standard for low-voltage automotive applications.

AOS Gen3 SiC MOSFETs provide up to a 30% improvement in switching FOM, while maintaining low conduction losses at high-load conditions.

The best approach now to securing LPWA IoT is developing products that are upgrade-ready and support crypto agility.

Skew represents a major design challenge for 224 Gbits/s PAM4 applications, causing delay differences within a differential ...

Aledia will showcase its FlexiNOVA customizable microLED platform for wearables, automotive, and consumer displays at Display ...

Wise-integration, in collaboration with Savoy, debuts a 7-kW SiC demo board for on-board chargers at PCIM 2025.

IoT development kits help accelerate the design of IoT devices as homes, buildings, and cities become more connected.

Selecting the right sensors and imaging components improves AI models for better decision-making in machine vision systems.

Silanna’s factory-configurable ADC Plural platform delivers improvements in affordability and lead times compared to legacy ...

AKM and SAL have developed a joint proof of concept for integrating a current sensor into a power module for automotive ...

Synaptics releases its first Veros triple-combo Wi-Fi 7 SoCs, supporting Wi-Fi, Bluetooth, and Zigbee/Thread with Matter ...

NoMIS claims significant reductions in on-resistance for its 1.2-kV planar SiC MOSFETs, supporting higher-frequency switching ...