A first-generation process head has been transferred to the project partner Photon Laser Manufacturing (PLM). It is mounted ...
Abstract: Heterogeneous integration is an efficiency way to integrate III-V laser diode on the silicon-based photonics integration circuit. To provide the III-V laser diode flip-chip bonding solution ...
A research team has successfully developed a new technology that converts the conductivity properties of semiconductors with just one laser process.
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