Semiconductor Packaging News12d
Veeco Elevates Next-Generation MicroLED Production with Lumina MOCVD System
Veeco Instruments Inc. announced that PlayNitride, an industry leader in MicroLED technology, has qualified Veeco's Lumina® MOCVD system for production ... Veeco Instruments Inc. We search for ...
Semiconductor Packaging News12d
AI Technology Completes Strategic Acquisition of Ormet Circuits Inc.
AI Technology (AIT) is pleased to announce the successful completion of its acquisition of Ormet Circuits Inc. (Ormet) from EMD Electronics, the U.S. and Canada Electronics ... AI Technology, Inc.
Semiconductor Packaging News12d
New TPSMB Asymmetrical TVS Diodes from Littelfuse Provide Superior Gate Driver Protection
Littelfuse, Inc. announced the launch of its TPSMB Asymmetrical TVS Diode Series, the first-to-market asymmetrical transient voltage suppression (TVS) diode specifically ...
Semiconductor Packaging News13d
DENSO and onsemi Collaborate for a Strengthened Relationship
DENSO CORPORATION and onsemi announced that they are strengthening their long-term relationship to support the procurement of autonomous driving (AD) and advanced ... Semiconductor Packaging News is ...
Semiconductor Packaging News13d
sureCore teams with Sarcina to package cryo chips
Further to sureCore's recent announcement about its launch of a range of cryogenic IP following the successful evaluation of test chips in both 180 nm and 22nm process nodes, ...
Semiconductor Packaging News12d
Toughened, Non-Drip Epoxy Features High Glass Transition Temperature
Master Bond Supreme 121AOND is a toughened epoxy system for bonding and sealing applications. It is a two component, heat curing system with a thixotropic paste consistency. ... Developed for medical ...
Semiconductor Packaging News13d
Good overall result and revenue growth for the ZEISS Group
ZEISS Group revenue increased to just under 11 billion euros (10.894 billion euros), (up 8% on the prior year) – EBIT 1,444 million euros (prior year: 1,686 million euros ... ZEISS partners with ...
Semiconductor Packaging News13d
SEMICON Korea 2025 to Spotlight Edge Technologies Shaping the AI Era
SEMICON Korea 2025 will take place Feb. 19-21 in Seoul at the COEX offering a comprehensive look into AI-driven technological advancements and edge technologies ... SEMICON Japan opens at Tokyo Big ...
Semiconductor Packaging News14d
China wants to dominate in AI — and some of its models are already beating their U.S. rivals
China's AI models, led by Alibaba's Qwen, are gaining global traction, rivaling U.S. counterparts like OpenAI. Open-source strategies, competitive performance, and favorable licensing drive their ...
Semiconductor Packaging News13d
Chip sector can give leg up on AI: association
Taiwan must harness its expertise in servers and chips to lead AI development, Wu Chih-yi urged at a tech conference. He stressed generative AI's dependence on advanced semiconductors and prioritized ...
Semiconductor Packaging News13d
Minister unveils Chip Team Taiwan initiative
Taiwan has launched the "Chip Team Taiwan" initiative to strengthen its robotics, drones, and space industries while reducing reliance on China. The plan prioritizes domestic chip production for ...
Semiconductor Packaging News13d
RISC-V Profiles Help Conformance
Experts emphasize stronger compliance and certification in RISC-V processor design to boost reliability across systems. Despite frameworks like RVA23, integration and testing hurdles demand advanced ...