Semiconductor Packaging News2d
Reliability On The Road: Multiphysics Design For Automotive 3D-ICs
Multiphysics Design For Automotive 3D-ICs: Summary Modern cars now rely on an astounding 1,500 computer chips, with advanced models packing up to 3,000. T ...
Semiconductor Packaging News2d
South Korean memory chip giants Samsung and SK Hynix push latest products at CIIE
South Korean memory chip giants Samsung and SK Hynix push latest products at CIIE: Summary Samsung and SK Hynix showcased cutting-edge memory products at Shanghai’s CIIE, addres ...
Semiconductor Packaging News2d
Qualcomm and Arm predict shaky growth next year
Summary Qualcomm and Arm Holdings reported strong earnings, driven by high-end smartphone demand and expansion into AI and automotive sectors. Despite beating estimates, both signaled caution about a ...
Semiconductor Packaging News2d
Trump likely to uphold CHIPS Act despite his campaign rhetoric, policy experts say
Trump likely to uphold CHIPS Act despite his campaign rhetoric, policy experts say: Summary Despite campaign criticism, President-elect Trump is unlikely to dismantle Biden’s CH ...
Semiconductor Packaging News2d
Huawei reportedly offers triple salaries to poach TSMC engineers
Huawei reportedly offers triple salaries to poach TSMC engineers: Summary Huawei is reportedly luring Taiwanese semiconductor engineers, especially from TSMC, by offering triple t ...
Semiconductor Packaging News2d
Advance in 4-inch heterostructure fabrication enhances AI semiconductors
Advance in 4-inch heterostructure fabrication enhances AI semiconductors: Summary A research team led by Hyeong-U Kim at KIMM has achieved a world-first: fabricating 4-inch hetero ...
Semiconductor Packaging News2d
TSMC poised to get final CHIPS Act awards
TSMC and GlobalFoundries have finalized agreements for billions in U.S. grants and loans to support semiconductor factories under the CHIPS Act, as the Biden administration accelerates funding efforts ...
Semiconductor Packaging News2d
Semiconductor firms ASML, AMD, Qualcomm reaffirm China commitment at CIIE trade fair
Semiconductor firms ASML, AMD, Qualcomm reaffirm China commitment at CIIE trade fair: Summary At Shanghai's CIIE trade fair, global semiconductor giants like ASML, AMD, and Qualco ...
Semiconductor Packaging News2d
Automotive OEMs Focus On SDVs, Zonal Architectures
Summary OEMs are pivoting to zonal architectures and software-defined vehicles (SDVs) to stay competitive amid financial pressures from low-cost EVs, especially from China. Investment in Advanced ...
Semiconductor Packaging News2d
Why AI could eat quantum computing’s lunch
Tech companies have invested billions in quantum computing, hoping to revolutionize fields like chemistry and materials science. However, AI is quickly advancing in these areas, potentially outpacing ...
Semiconductor Packaging News2d
TSMC Cannot Make 2nm Chips Abroad Now: MOEA
Summary Taiwan's technology protection rules restrict TSMC from producing its 2-nanometer chips overseas, ensuring cutting-edge tech remains at home, Economic Affairs Minister J.W. Kuo stated. Despite ...
Semiconductor Packaging News9d
Why 40G UCIe IP?
Summary Synopsys's 40G UCIe IP tackles the demand for high bandwidth in AI computing, offering 25% more bandwidth with energy efficiency. This advanced architecture boosts data processing for AI ...